eMMC-Module
Industrielle eMMCs sind eine neuartige Speicherlösung, welche NAND-Speicherzellen und Controller mit der schnellen MMC-Schnittstelle in einem Package kombinieren. Dadurch kann die eMMC alle Hintergrundoperationen intern steuern und befreit die Hostapplikation von der Steuerung der Flash-Zellen und vereinfacht somit die Integration erheblich.
Die eMMC ist konform zum neuesten JEDEC eMMC 5.1 Standard (JESD84-B51) und bietet Command Queuing und Cache Barrier für verbesserte random read/write Geschwindigkeit.
Hauptmerkmale
- JEDEC eMMC v5.1 Standard konform (JESD84-B51)
- 153-ball FBGA (RoHS-konform, "green package")
- industrieller Temperaturbereich (-40°C bis +85°C)
- LDPC ECC Engine (auf Projektbasis)
- basierend auf 3D NAND
- Kapazitäten 8GB bis 128GB
- SRAM Soft Error Detection
- AutoRefresh, Dynamic Data Refresh und Read Disturb Management
- erhöhte Endurance: 2-3x die Endurance einer gewöhnlichen eMMC
Spezifikationen
e.MMC | |||||||
---|---|---|---|---|---|---|---|
Product Name | Industrial Grade | Industrial Grade | Industrial Grade | Automotive Grade 3 | Automotive Grade 3 | Automotive Grade 2 | Automotive Grade 2 |
Product Line | Premium | Premium | Superior | Premium | Superior | Premium | Superior |
Naming | E800Pi | E700Pi | E600Si | E700Pia | E600Sia | E700Paa | E600Saa |
IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
JEDEC Specification | v4.41 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
Flash Type | Native SLC | 3D SLC Mode | 3D NAND | 3D SLC Mode | 3D NAND | 3D SLC Mode | 3D NAND |
Density* | 1 GB to 2 GB | 8 GB to 64 GB | 16 GB to 128 GB | 8 GB to 64 GB | 16 GB to 128 GB | 8 GB to 64 GB | 16 GB to 128 GB |
Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
Performance** Seq. Read/Write up to (MB/s) | 31 / 23 | 300 / 240 | 300 / 170 | 300 / 240 | 300 / 170 | 300 / 240 | 300 / 170 |
Performance** Random Read/Write up to (IOPS) | 750 / 1000 | 15K / 30K | 15K / 30K | 15K / 30K | 15K / 30K | 15K / 30K | 15K / 30K |
Operating Temperature | -40°C to 85°C (Industrial) | -40°C to 85°C (Industrial) | -40°C to 85°C (Industrial) | -40°C to 85°C (AEC-Q100 Grade 3) | -40°C to 85°C (AEC-Q100 Grade 3) | -40°C to 105°C (AEC-Q100 Grade 2) | -40°C to 105°C (AEC-Q100 Grade 2) |
Reliability Max. TBW** | 90 TB | 1320 TB | 824 TB | 1320 TB | 824 TB | 1213 TB | 309 TB |
Reliability MTBF @ 25°C | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours |
ICC (Typical RMS in Read/Write) mA | 93 | 135 / 155 | 135 / 180 | 135 / 155 | 135 / 180 | 135 / 155 | 135 / 180 |
ICCQ (Typical RMS in Read/Write) mA | 69 | 110 / 95 | 110 / 100 | 110 / 95 | 110 / 100 | 110 / 95 | 110 / 100 |
Dimensions: L x W x H (mm) | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) |
**Die gesamte Leistung wird unter Verwendung einer proprietären CDA-Testumgebung gesammelt oder gemessen, ohne Dateisystem-Overhead.
Produktlinie
Technologien und zusätzliche Services | Produktlinie | |
---|---|---|
Premium | Superior | |
Life Monitor
|
customizable
|
customizable
|
Sudden Power-Off Recovery (SPOR)
|
available
|
available
|
End-to End Data Protection
|
customizable
|
available
|
AutoRefresh
|
available
|
available
|
Vibration-Proof BGA Package
|
available
|
available
|
Dynamic Data Refresh
|
available
|
available
|
Industrial Temperature
|
available
|
available
|
SiP (System in Package)
|
available
|
available
|
Complete Drive Test
|
available
|
available
|
customizable
kundenspezifische Optionen auf ProjektbasisTechnologien und zusätzliche Services | Produktlinie | |
---|---|---|
Premium | Superior | |
Life Monitor
|
customizable
|
customizable
|
Sudden Power-Off Recovery (SPOR)
|
available
|
available
|
End-to-End Data Protection
|
customizable
|
available
|
AutoRefresh
|
available
|
available
|
Vibration-Proof BGA Package
|
available
|
available
|
Dynamic Data Refresh
|
available
|
available
|
Industrial Temperature
|
available
|
available
|
SiP (System in Package)
|
available
|
available
|
Complete Drive Test
|
available
|
available
|