e.MMC
Industrial eMMCs are a novel storage solution combining NAND memory cells and controller with the fast MMC interface in one package. The eMMC can thus internally control all background operations and releases the host application from controlling the flash cells which makes integration easier.
The eMMC is conforming with the latest JEDEC eMMC 5.1 Standard (JESD84-B51) and provides Command Queuing and Cache Barrier for better random read/write speed.
The eMMC is conforming with the latest JEDEC eMMC 5.1 Standard (JESD84-B51) and provides Command Queuing and Cache Barrier for better random read/write speed.
Key features
- JEDEC eMMC v5.1 standard conforming (JESD84-B51)
- 153-ball FBGA (RoHS conforming, "green package", industrial temperature range (-40°C to+85°C)
- LDPC ECC Engine (on project basis)
- Based on 3D NAND
- Capacities from 8GB to 128GB
- SRAM Soft Error Detection
- AutoRefresh, Dynamic Data Refresh and Read Disturb Management
- Longer endurance: 2-3x that of a common eMMC
Specifications
| e.MMC | |||||||
|---|---|---|---|---|---|---|---|
| Product Name | Industrial Grade | Industrial Grade | Industrial Grade | Automotive Grade 3 | Automotive Grade 3 | Automotive Grade 2 | Automotive Grade 2 |
| Product Line | Premium | Premium | Superior | Premium | Superior | Premium | Superior |
| Naming | E800Pi | E700Pi | E600Si | E700Pia | E600Sia | E700Paa | E600Saa |
| IC Package | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA | 153-ball FBGA |
| JEDEC Specification | v4.41 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 | v5.1, HS400 |
| Flash Type | Native SLC | 3D SLC Mode | 3D NAND | 3D SLC Mode | 3D NAND | 3D SLC Mode | 3D NAND |
| Density* | 1 GB to 2 GB | 8 GB to 64 GB | 16 GB to 128 GB | 8 GB to 64 GB | 16 GB to 128 GB | 8 GB to 64 GB | 16 GB to 128 GB |
| Bus Speed Modes | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 | x1 / x4 / x8 |
| Performance** Seq. Read/Write up to (MB/s) | 31 / 23 | 300 / 240 | 300 / 170 | 300 / 240 | 300 / 170 | 300 / 240 | 300 / 170 |
| Performance** Random Read/Write up to (IOPS) | 750 / 1000 | 15K / 30K | 15K / 30K | 15K / 30K | 15K / 30K | 15K / 30K | 15K / 30K |
| Operating Temperature | -40°C to 85°C (Industrial) | -40°C to 85°C (Industrial) | -40°C to 85°C (Industrial) | -40°C to 85°C (AEC-Q100 Grade 3) | -40°C to 85°C (AEC-Q100 Grade 3) | -40°C to 105°C (AEC-Q100 Grade 2) | -40°C to 105°C (AEC-Q100 Grade 2) |
| Reliability Max. TBW** | 90 TB | 1320 TB | 824 TB | 1320 TB | 824 TB | 1213 TB | 309 TB |
| Reliability MTBF @ 25°C | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours | > 2,000,000 Device hours |
| ICC (Typical RMS in Read/Write) mA | 93 | 135 / 155 | 135 / 180 | 135 / 155 | 135 / 180 | 135 / 155 | 135 / 180 |
| ICCQ (Typical RMS in Read/Write) mA | 69 | 110 / 95 | 110 / 100 | 110 / 95 | 110 / 100 | 110 / 95 | 110 / 100 |
| Dimensions: L x W x H (mm) | 11.5 x 13.0 x 1.0 | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) | 11.5 x 13.0 x 1.3 (max.) |
Product line
| Technologien und zusätzliche Services | Produktlinie | |
|---|---|---|
| Premium | Superior | |
 Life Monitor |
customizable
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customizable
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 Sudden Power-Off Recovery (SPOR) |
available
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available
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 End-to End Data Protection |
customizable
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available
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 AutoRefresh |
available
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available
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 Vibration-Proof BGA Package |
available
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available
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 Dynamic Data Refresh |
available
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available
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 Industrial Temperature |
available
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available
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 SiP (System in Package) |
available
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available
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 Complete Drive Test |
available
|
available
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customizable
customized options on a project basis| Technologien und zusätzliche Services | Produktlinie | |
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| Premium | Superior | |
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